发明名称 Ambient-curable anisotropic conductive adhesive
摘要 <p>Compositions of ambient-curable anisotropic conductive adhesive comprising an ambient-curable epoxy resin system and a conductive powder are proposed. It can be cured under ambient conditions using common magnet for clamping mechanism. This greatly simplifies many electronic repairs or Do-It-Yourself types of application. This anisotropic conductive adhesive can also be applied using traditional hot-bar laminator, but at lowered temperatures, and this is bound to open up new application possibilities.</p>
申请公布号 EP2240006(A1) 申请公布日期 2010.10.13
申请号 EP20090008641 申请日期 2009.07.01
申请人 TEAMCHEM COMPANY 发明人 YEH, SYH-TAU
分类号 H05K3/32;C09J9/02;H01L21/60;H01R4/04 主分类号 H05K3/32
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