| 摘要 |
PROBLEM TO BE SOLVED: To enable a printed board to be prevented from deteriorating in reliability due to a thermal stress given to it when an LSI provided with many pins and soldered to the printed board is dismounted from the printed board and improved in repairability. SOLUTION: Input/output pins 33 are each press-fitted into through-holes 36 provided on a printed board 34 and kept protruding from it, solder is supplied to pads 32 provided on the underside of a LSI package 31, and the LSI package 31 is mounted on the pins 33 and soldered. When the LSI package 31 is detached from the pins 33, the LSI package 31 is heated to melt solder, whereby the LSI package 31 can be easily dismounted. No thermal stress is given to the printed board 34. |
