| 摘要 |
PROBLEM TO BE SOLVED: To prevent a wire from being peeled off even of power on/off is repeated at the time of use by making the form of the crossing face of the connection part between the semiconductor chip and the wire in a semiconductor device in a form where a center is recessed. SOLUTION: Since ultrasonic vibration is transmitted to the connection part 2 for executing bonding by giving ultrasonic vibration in ultrasonic bonding, the wire is tightly suppressed by a wedge 3 and it is fixed. In such a case, the wedge 3 having the projecting form in the center of the tip is used. The wedge has the recessed parts at the ends and has the projecting form in the center. The wire is securely guided by the recessed parts at the ends and sound junction is realized. The center of the wire connection part 2a is recessed by the projecting form the center and the stress of an interface at the time of use is reduced. Thus, the connection part is prevented from being peeled off. |
