| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device which is high in connection reliability with a semiconductor package and a motherboard, and a semiconductor package being mounted on a motherboard to produce a highly reliable electronic device. SOLUTION: This electronic device comprises a wiring film having a device hole 17a and arranged on one major surface thereof, with wiring 18, e.g., signal lines, external connection terminals, an inner lead 19, or the like, a semiconductor element 20 disposed in the device hole 17a of the wiring film and connected electrically with the end part of the inner lead 19, a shape holding plate (stiffener) 22 bonded to the other major surface of the wiring film, a glass epoxy wiring board 27 having connection pads on one major surface, and solder bumps 26 arranged on the external connection terminals of the wiring film and connected with the connection pads on the glass epoxy wiring board 27. The stiffener 22 is composed of a metal having a coefficient of thermal expansion substantially equal to that of the motherboard, i.e., the glass epoxy wiring board 27. |
