发明名称 HARD CONDUCTIVE PARTICLE EXCELLENT IN SOLDER DISPERSIBILITY
摘要 PROBLEM TO BE SOLVED: To provide a conductive particle that is excellent in a solder diffusing property and improves wear resistance by the dispersion. SOLUTION: This particle is made by forming a conductive metal layer having a thickness of 0.1-5μm constituted of Au, Ag, Cu, Al and their alloy, and on top of it, a reaction suppressing layer having a diameter of 0.05-0.5μm constituted of Pt, Pd or their alloy on a ceramic particle having a particle diameter of not more than 50μm by a physical deposition method. Then, the outermost layer is coated with Ni, Cu and their alloy as a dispersion accelerating layer having a thickness of 0.1-2μm, and there is formed a hard conductive particle of which crystal lattice diameter calculated from the half-value width of an X-ray diffraction peak of the three layers is not more than 300 nm.
申请公布号 JPH11134933(A) 申请公布日期 1999.05.21
申请号 JP19970311556 申请日期 1997.10.29
申请人 NISSHIN STEEL CO LTD 发明人 SAIDA JUNJI;ARAIYAMA MASATO;TANAKA YASUSUKE;TAKESHIMA EIKI
分类号 B22F1/02;C23C14/00;C23C14/06;C23C14/34;C23C28/04;H01B1/00;(IPC1-7):H01B1/00 主分类号 B22F1/02
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