Apparatus for dicing a semiconductor device substrate and a process therefor

摘要

An integrated apparatus (10) has a dicing station (14) and a rinsing/heated drying station (16). In one embodiment, the rinsing/heated drying station (16) has a heater, such as an infrared lamp (36), or uses a heated gas. The integrating apparatus (10) helps to decrease the time between dicing and heated drying, which reduces the likelihood of corrosion of C4 bumps (64).