发明名称 Polishing apparatus and polishing method
摘要 A polishing apparatus comprises a first surface plate for supporting a polishing object, a driving mechanism for rotating the first surface plate, a second surface plate arranged so as to oppose to the first surface plate, an abrasive cloth stuck to the second surface plate, a vibration detector attached to the first surface plate or the second surface plate for detecting vibration in polishing, a controlling portion for controlling polishing operation of the first surface plate and the second surface plate, and signal analyzing unit for analyzing vibration intensity detected by the a vibration detector through frequency analysis, integrating the vibration intensity relative to time, and transmitting a polishing stop signal to stop polishing operation of the first surface plate and the second surface plate to the controlling portion when variation in a resultant integral value relative to time is less than a first reference value or when the resultant integral value is less than a second reference value.
申请公布号 US5904609(A) 申请公布日期 1999.05.18
申请号 US19960637433 申请日期 1996.04.25
申请人 FUJITSU LIMITED 发明人 FUKURODA, ATSUSHI;ARIMOTO, YOSHIHIRO;NAKAMURA, KO
分类号 B24B37/04;G05B19/416;(IPC1-7):B24B49/00 主分类号 B24B37/04
代理机构 代理人
主权项
地址