发明名称 |
Use of preceramic polymers as electronic adhesives |
摘要 |
A method of adhering an electronic component to substrate in which a layer of a preceramic polymer is applied between the electronic component and the substrate to which it is to be adhered followed by heating to convert the preceramic polymer into a ceramic. The method forms a strong bond which is not affected by the environment. The method is valuable for adhering integrated circuit chips to carriers or circuit boards. |
申请公布号 |
US5904791(A) |
申请公布日期 |
1999.05.18 |
申请号 |
US19970867300 |
申请日期 |
1997.06.02 |
申请人 |
DOW CORNING CORPORATION |
发明人 |
BEARINGER, CLAYTON R.;CAMILLETTI, ROBERT CHARLES;CHANDRA, GRISH;GENTLE, THERESA EILEEN;HALUSKA, LOREN ANDREW |
分类号 |
H05K7/12;C09J5/02;C09J5/06;H01L21/58;(IPC1-7):B32B31/26;H05K7/02 |
主分类号 |
H05K7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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