发明名称 |
POWER HYBRID INTEGRATED CIRCUIT APPARATUS |
摘要 |
An input-output wiring for the power circuit and a ground layer are formed on a metal substrate of a power hybrid integrated circuit apparatus. A plurality of windows are opened at predetermined positions of a circuit substrate to which electronic parts such as an IC driver, a chip resistor etc. are connected. Ceramic chips are soldered on the exposed surface of the metal substrate in the windows, and the power semiconductor elements are connected through metal bridges on the ceramic chips. Connection between lower electrode of adjoining power semiconductor elements or between lower part of the power semiconductor element and an input/output wiring is made by means of a part of the metal bridge. |
申请公布号 |
KR100182776(B1) |
申请公布日期 |
1999.05.15 |
申请号 |
KR19950005404 |
申请日期 |
1995.03.16 |
申请人 |
HITACHI LTD. |
发明人 |
DAKAHASHI, MASAAKI;YAMADA, KAZUJI;MIYAZAKI, HIDEKI;KATO, KAZUO |
分类号 |
H05K1/05;H01L23/14;H01L25/16;H05K1/03;H05K1/14;H05K3/22 |
主分类号 |
H05K1/05 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|