发明名称 PRODUCTION OF LEAD FRAME FOR LOC
摘要 PROBLEM TO BE SOLVED: To provide a method for producing a lead frame for LOC having high work efficiency in which adhesive can be applied surely at low cost, even if a led frame for LOC having a large number of leads is applied with an adhesive. SOLUTION: A plurality of inner lead parts 10 of a lead frame for LOC 5 are arranged under a stripper 2. A protective sheet 7 having one side applied with a thermoplastic insulating adhesive 8 of 3-30μm thickness is secured (101) between the stripper 2 and the inner lead part 10 with the adhesive 8 side being directed toward the inner lead part 10. The adhesive 8 is then pressed against the inner lead part 10 via the protective sheet 7 by means of a punch 1. Consequently, a specified part of the adhesive 8 is pasted (102) to the inner lead part 10. When the punch 1 is subsequently lifted, the part of the adhesive 8 touching the inner lead part 10 is stripped from the protective sheet 7 and applied (103) to the inner lead part 10.
申请公布号 JPH11126862(A) 申请公布日期 1999.05.11
申请号 JP19970290864 申请日期 1997.10.23
申请人 HITACHI CABLE LTD 发明人 YAMAMOTO KAZUHIRO
分类号 H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/50
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