发明名称 HEAT SINK FOR AN ELECTRONIC COMPONENT
摘要 <p>A new heat sink is disclosed that has a chimney effect. The chimney is got through stamping out a part (10) of a flat plate (2). The active electronic component (6) is attached to the stamped out part (10) by a clip (5). Other improvement includes legs (3) with an elastic member (21) for clipping the sink on a printed circuit board.</p>
申请公布号 WO1999022405(A1) 申请公布日期 1999.05.06
申请号 EP1998006975 申请日期 1998.10.19
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