发明名称 |
Transfer of flux onto electrodes and production of bumps on electrodes |
摘要 |
A process of transferring a flux on electrodes of a semiconductor chip, a film carrier, or a substrate, the process comprising: using a transfer apparatus including a transfer baseplate having protrusions corresponding to said electrodes; dipping the tips of the protrusions of the transfer baseplate in a flux bath to cause the flux to stick to the tips; then aligning the protrusions of the transfer baseplate with the electrodes; and transferring the stuck flux onto the electrodes from the tips.
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申请公布号 |
US5899376(A) |
申请公布日期 |
1999.05.04 |
申请号 |
US19960677392 |
申请日期 |
1996.07.09 |
申请人 |
NIPPON STEEL CORPORATION |
发明人 |
TATUMI, KOUHEI;SHIMOKAWA, KENJI;HASHINO, EIJI |
分类号 |
B23K1/20;H05K3/34;(IPC1-7):B23K1/20 |
主分类号 |
B23K1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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