| 摘要 |
PROBLEM TO BE SOLVED: To provide a tape for double-sided wiring TAB which is capable of realizing fine pitches of at most 100μm. SOLUTION: A copper foil signal layer 22, in which a wiring pattern is made a fine wiring at most 100μm and a thickness set at most 20μm is formed on the side surface of a polyimide based film 21. Similarly, a ground layer (or a power source layer) 23 having the same wiring pitch and thickness is formed on the other surface of the base film 21. A specified number of blind via holes 24 for connecting wiring layers formed on both of the surfaces are formed on the base film 21. Since the thickness of the copper foil of the copper foil signal layer 22 is made at the most 20μm, a fine wiring at most 100μm is enabled, and coping with an LSI of 400-100 pins is enabled.
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