发明名称 |
Lead frame bonding power distribution systems |
摘要 |
An integrated circuit package includes an integrated circuit chip having first and second opposing faces and a plurality of pads on the first face of the integrated circuit chip. A plurality of external pins is also included along with a plurality of wires, a respective one of which electrically connects a respective external pin to a respective pad. A conductive lead frame is located adjacent and electrically contacting the second face of the integrated circuit chip. A first wire electrically connects a select one of the pads to the conductive lead frame. A second wire electrically connects a selected one of the pins to the conductive lead frame. Accordingly, power can be distributed to an integrated circuit package with reduced variation across the chip.
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申请公布号 |
US5898225(A) |
申请公布日期 |
1999.04.27 |
申请号 |
US19960696399 |
申请日期 |
1996.08.14 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHOI, CHI-YOUNG |
分类号 |
H01L21/822;H01L21/60;H01L23/495;H01L23/50;H01L27/04;(IPC1-7):H01L23/495;H01L23/48 |
主分类号 |
H01L21/822 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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