| 摘要 |
PROBLEM TO BE SOLVED: To obtain a positive photosensitive resin compsn. capable of giving a pattern having high adhesion and excellent in resolution at the time of development and forming a film having satisfactory waterproofing adhesive property to a substrate after heat treatment by using a specified polyamide, naphthoquinone diazide and a specified adhesive as essential components. SOLUTION: The photosensitive resin compsn. contains 100 pts.wt. polyamide contg. repeating units of formula I, 0.5-40 pts.wt. naphthoquinone diazide and 0.05-20 pts.wt. adhesive of formula II and/or formula III as essential components. In the formula I each of X1 and X2 is a divalent arom. group. In the formulae II, III, X4 is a divalent org. group contg. C directly bonded to Si, (m) is an integer of 0 or 1, each of R1 and R2 is 1-4C alkyl, (n) is an integer of 0, 1 or 2, X, is divalent hydrocarbon having bonding radicals to adjacent C atoms or the like, X5 is a group of formula IV and X6 is -O-, -CO- or the like. The components are dissolved in a solvent and used in the state of varnish. |
