| 摘要 |
<p>A photosensitive polyimide composition soluble in organic solvents, excellent in adhesiveness, heat resistance, mechanical characteristics and flexibility, and capable of exhibiting alkali-soluble, highly sensitive positive photoresist characteristics upon irradiation with light. The composition comprises a photoacid generator and a solvent soluble polyimide exhibiting positive photosensitivity in the presence of the generator.</p> |
