发明名称 Vertical bipolar transistor
摘要 Vertical bipolar transistor production comprises applying a first insulating layer, a conductive layer (5) and a second insulating layer (6) onto a semiconductor substrate, etching an opening, isotropically etching the first insulating layer to produce a gap and then filling the gap with a contact layer. A vertical bipolar transistor is produced in an active semiconductor substrate zone having a buried collector (2) by: (a) successively applying a first insulating layer, a first conductive layer (5) and a second insulating layer (6) onto the active zone; (b) etching an opening through the second insulating layer (6) and the conductive layer (5); (c) isotropically etching the first insulating layer to produce a gap between the active region surface and the first conductive layer (5); (d) producing the base by implantation in the opening; (e) producing a contact layer which fills the gap and connects the base to the first conductive layer; (f) producing insulating spacers on the opening side walls; (g) producing a second conductive layer (13) as the emitter connection in the remaining opening and producing an emitter connected to the emitter connection in the active region; and (h) producing a connection for the buried collector. An Independent claim is also included for a vertical bipolar transistor produced by the above process.
申请公布号 DE19742624(A1) 申请公布日期 1999.04.22
申请号 DE19971042624 申请日期 1997.09.26
申请人 SIEMENS AG, 80333 MUENCHEN, DE 发明人 WINTERS, REINER, DR., 81379 MUENCHEN, DE
分类号 H01L21/331;H01L21/8249;(IPC1-7):H01L21/331;H01L21/824;H01L29/732 主分类号 H01L21/331
代理机构 代理人
主权项
地址