发明名称 |
Vertical bipolar transistor |
摘要 |
Vertical bipolar transistor production comprises applying a first insulating layer, a conductive layer (5) and a second insulating layer (6) onto a semiconductor substrate, etching an opening, isotropically etching the first insulating layer to produce a gap and then filling the gap with a contact layer. A vertical bipolar transistor is produced in an active semiconductor substrate zone having a buried collector (2) by: (a) successively applying a first insulating layer, a first conductive layer (5) and a second insulating layer (6) onto the active zone; (b) etching an opening through the second insulating layer (6) and the conductive layer (5); (c) isotropically etching the first insulating layer to produce a gap between the active region surface and the first conductive layer (5); (d) producing the base by implantation in the opening; (e) producing a contact layer which fills the gap and connects the base to the first conductive layer; (f) producing insulating spacers on the opening side walls; (g) producing a second conductive layer (13) as the emitter connection in the remaining opening and producing an emitter connected to the emitter connection in the active region; and (h) producing a connection for the buried collector. An Independent claim is also included for a vertical bipolar transistor produced by the above process.
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申请公布号 |
DE19742624(A1) |
申请公布日期 |
1999.04.22 |
申请号 |
DE19971042624 |
申请日期 |
1997.09.26 |
申请人 |
SIEMENS AG, 80333 MUENCHEN, DE |
发明人 |
WINTERS, REINER, DR., 81379 MUENCHEN, DE |
分类号 |
H01L21/331;H01L21/8249;(IPC1-7):H01L21/331;H01L21/824;H01L29/732 |
主分类号 |
H01L21/331 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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