PARTIAL PLATING EQUIPMENT OF HOOP MATERIAL AND PARTIAL PLATING METHOD USING THE SAME,申请号JP19970269564-传众专利搜索

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发明名称	PARTIAL PLATING EQUIPMENT OF HOOP MATERIAL AND PARTIAL PLATING METHOD USING THE SAME
摘要
申请公布号	JPH11106983(A)	申请公布日期	1999.04.20
申请号	JP19970269564	申请日期	1997.10.02
申请人	MATSUSHITA ELECTRON CORP	发明人	HAMADA YOSHIAKI
分类号	C25D5/02;(IPC1-7):C25D5/02	主分类号	C25D5/02
代理机构		代理人
主权项
地址

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