发明名称 PROCESS OF PRODUCTION OF THIN-FILM DIELECTRIC OF ALUMINUM DIOXIDE FOR MANUFACTURE OF METAL-DIELECTRIC-SEMICONDUCTOR DEVICES
摘要 FIELD: manufacture of metal-dielectric-semiconductor devices. SUBSTANCE: thin-film dielectric of aluminum dioxide is formed on surface of substrate at temperature of 180-400 C by deposition from gas phase due to reaction between aluminum chloride, oxygen and nitrogen oxide. EFFECT: increased efficiency of process.
申请公布号 RU2129094(C1) 申请公布日期 1999.04.20
申请号 RU19950113257 申请日期 1995.07.26
申请人 DAGESTANSKIJ GOSUDARSTVENNYJ TEKHNICHESKIJ UNIVERS 发明人 SARKAROV T.EH.;ADAMOV A.P.;KHASPULATOV KH.A.
分类号 C01F7/02;C23C18/12;(IPC1-7):C01F7/02 主分类号 C01F7/02
代理机构 代理人
主权项
地址