Integrated semiconductor component with chip and numerous connecting points

摘要

The semiconductor chip (1) and the component encapsulating resin layer (5) form a core material. The support (3) and reinforcing (4) bases are skin materials, and the core material and ski materials form a sandwich structure. The connections of the conductors (6) with the connecting points (12) are located on a surface (3a) of the support base, while the conductors are located on the other surface (3b) of the support base. The external terminals (8) are formed on the support base surface (3b) with the conductors, the connecting points and conductors are coupled by bond wires (7).