发明名称 Edge structure for semiconductor component e.g. diode
摘要 The edge structure has at least two electrodes (A,K) lying opposite each other on two opposing sides of a semiconductor body (1,2). At least on pn transition (3,2) is provided in a middle region of the semiconductor component surrounded by the edge region and between the two electrodes. The structure also has an insulating layer (6) or a junction termination zone which extends between the middle region and the edge region from a side of the semiconductor body towards the other side, to a depth in the region of the charge carrier diffusion length. Field rings (4,5) may be provided in the edge region. Alternatively a zone with lateral variation in the doping may be provided in the edge region. Alternatively a weakly doped zone e.g. of silicon oxide or silicon nitride may be provided in the edge region.
申请公布号 DE19741970(A1) 申请公布日期 1999.04.01
申请号 DE19971041970 申请日期 1997.09.23
申请人 SIEMENS AG, 80333 MUENCHEN, DE 发明人 BRUNNER, HEINRICH, DR., 84405 DORFEN, DE
分类号 H01L29/06;H01L29/861;(IPC1-7):H01L29/861;H01L29/74 主分类号 H01L29/06
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