| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a bump which is applicable even in the case of narrowing an inter-electrode distance in an IC chip of an overall surface electrode by prolonging the lifetime of a bump-forming capillary. SOLUTION: A circumferential surface-like cut-out part is formed on the end part of a capillary 1 body, and a height (h) of the cutout part is set to a range of 1/2 or more of a height L of a bump bottom 4a to 2.0 times or less of a length l of a wire residue 2a, retained above a bump 4 as possible. Preferably, the cut-out shape of the cutout part is within inside of a straight line AB for connecting a cut-out start point A in a longitudinal section passing through an axial center of the body to an outer circumferential point B of the end face of the capillary 1. The outer diameter of the cut-out part is not smaller than the outer diameter of the end face of the capillary. According to this method, such a bump-forming capillary 1 as this is used. |
