A microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive attached to an RF substrate with a cavity formed at its center and a pattern of conductive paths for providing interconnection from the inside to the outside of the package. The base may be metal or ceramic with a metal layer deposited thereon. A sealing cap is attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.
申请公布号
EP0902975(A1)
申请公布日期
1999.03.24
申请号
EP19970918585
申请日期
1997.04.11
申请人
STRATEDGE CORPORATION
发明人
WEIN, DEBORAH, S.;ANDERSON, PAUL, M.;LINDNER, ALAN, W.;GOETZ, MARTIN;BABIARZ, JOSEPH