Methods of making microelectronic assemblies

摘要

A method of making a microelectronic assembly includes providing a starting subassembly having a microelectronic component with a top surface and having electrical contacts, the subassembly further including a plurality of terminals over the top surface of the component, each terminal being connected to at least one contact of the component but moveable with respect to the component; positioning a plurality of joining units each having a solid core on the terminal; providing a unit bonding material at interfaces between each core terminal; and bonding the joining units to the terminals by heating the joining units and terminals so as to convert the unit bonding material to a liquid phase without melting the cores and solidifying the unit bonding material.