| 摘要 |
PROBLEM TO BE SOLVED: To enhance polishing accuracy for a wafer by polishing the wafer with slurry sufficiently impregnated into polishing cloth. SOLUTION: Annular members 28 and 62 are provided, which are pressed onto polishing cloth together with a wafer 50 while the circumference of the wafer is being enclosed. Both a groove 29 guiding slurry toward the wafer 50 and a flat surface 62A for impregnating the slurry into the polishing cloth 16 guided along the aforesaid groove 29, are formed in the surfaces of the annular members 28 and 62 brought into contact with the aforesaid polishing cloth. By this constitution, since the wafer 50 can be polished with the polishing cloth 16 sufficiently impregnated with the slurry, polishing accuracy can thereby be enhanced. |
