发明名称 |
Ball grid array with inexpensive threaded secure locking mechanism to allow removal of a threaded heat sink therefrom |
摘要 |
An integrated circuit package having a die supported on a ball grid array substrate and wire bonds electrically connecting the die to the substrate. Supported on the substrate is a lock ring having a threaded opening encircling the die. Encapsulant covers the die and the wire bonds and adheres the lock ring to the substrate. A heat sink having a threaded portion can be threaded into the lock ring into an operative cooling position relative to the die and subsequently to an unthreaded removed position. When in the latter position, a repair station can be positioned over the package and the solder balls are accessible for hot gas melting thereof for removal (or replacement) of the package from the underlying motherboard.
|
申请公布号 |
US5885848(A) |
申请公布日期 |
1999.03.23 |
申请号 |
US19970901489 |
申请日期 |
1997.07.28 |
申请人 |
LSI LOGIC CORPORATION |
发明人 |
KIRKLAND, JANET;SCHNEIDER, MARK R. |
分类号 |
H01L23/24;H01L23/40;H01L23/433;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L23/24 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|