| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size and weight and secure reliability for thermal stress, when mounting an SAW(surface acoustic waves) element on a mounting substrate and sealing it using resin. SOLUTION: This structure includes a mounting substrate 6 having connection pads 7, an SAW element 1 mounted on the mounting substrate 6 by connecting connection pads 4 to the connection pads 7 of the mounting substrate 6 by Au bumps 5, with its function face facing the mounting substrate, and photosensitive resin 8 filled between the SAW element 1 and the mounting substrate 6 in the periphery of the SAW element 1. When sealing this structure, it is sealed with a photosetting resin 8 with a space being secured between the mounting substrate 1 and a vibration propagating section formed in the function face of the SAW element 1. By doing so, there is only the photosetting resin 8 existing between the SAW element 1 and the mounting substrate 6, so that the mounting structure can be nearly the size of the SAW element 1 and the size of the entire device can be reduced. Furthermore, by exposing and developing the photosetting resin 8, after applying it on the function face of the SAW element 1, the photosensitive resin 8 can be made to exist only in the periphery of the SAW element 1, which allows easy mounting. |
