TAPE CARRIER OF HIGH FLEXIBILITY FOR MOUNTING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To lessen thermal stresses between layers of constituent materials and to minimize, particularly the thermal stress on a solder ball. SOLUTION: Coefficients of viscoelasticity of a bonding agent 12 for a copper foil, an elastomer bonding agent 13, a bonding agent 19 for a chip and a solder resist 7 which are constituent materials of this tape carrier are made equal to or less than the coefficient of viscoelasticity of a polyimide film 3. Thereby thermal stresses between the layers of the constituent materials is reduced, and particularly, the thermal stress on a solder ball 6 is minimized.