| 摘要 |
PROBLEM TO BE SOLVED: To form a conductive film at a high speed and eliminate generation of any defect of an electrode wiring due to disconnection, by employing a step of forming a deposited film without applying a bias voltage to a board and a step of forming a deposited film while applying a bias voltage to the board. SOLUTION: In forming at least two deposited films on a recessed and protruding surface of a board, a step of forming a deposited film without applying a bias voltage to the board and a step of forming a deposited film while applying a bias voltage to the board are employed. In this case, it is preferred to employ a method for forming a deposited film on the recessed and protruding surface of the board without applying a bias voltage thereto, and then forming a deposited film while applying a bias voltage to the board. Specifically, at the time of forming the deposited films, it is preferred to form a deposited film without applying a bias voltage up to 70% or more of a desired thickness from the start of film formation, and to form a deposited film while applying a bias voltage for 20 to 30% of the desired thickness. |
