| 摘要 |
PROBLEM TO BE SOLVED: To make a device thin and light in weight by preventing surface wave propagation path surface from being coated with resin, coating other function surface with the resin, adhering a piezoelectric substrate and a circuit board through coated resin and shielding vibration space from the outside. SOLUTION: Surface wave propagation paths 14 and electrode pads 15 are formed on a piezoelectric substrate 11 and bumps 16 for electric connection to a circuit board 12 are formed on the pads 15 on the piezoelectric substrate. On the other hand, electric pads 15 are also formed on the ceramic circuit board 12. Next, resin film 13 that does not include conductive particles is temporarily adhered on a mounted surface of the board 12. Then, the resin film on the pads 15 of the board 12 and that on the port that conesponds to the surface wave propagation path of the substrate 11 are opened by a laser. Finally, after the substrate 11 and the board 12 are positioned, both are virtually crimped by performing thermocompression bonding by a facedown method, and sealing is completed. With this, an SAW device that has vibration space 17 of the paths 14 is produced. |
