DEVICE AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide an electronic component mounting device and an electronic component mounting method, by which electronic components are mounted at a high speed with high reliability. SOLUTION: A board 3 is moved forward/backward in directions X by a forward/backward moving table 2. Lots of parts feeders 11 are provided at both sides of the forward/backward moving table 2 at a pitch. Lots of Y direction guides 22 are placed above the forward/backward moving table 2 at a pitch. Two mobile heads 30 are mounted onto each guide 22. Each mounting head 30 uses a nozzle to pick up and vacuum-adsorb an electronic component in a parts feeder 11 and mounts the component on the board 3. An X coordinate for mounting the electronic component is decided by the moving quantity of the board 3 by the forward/backward moving table 2, and a Y coordinate for mounting the electronic component is decided by the moving quantity of the mobile head 30 in the direction Y.