| 发明名称 |
Thermal stress relieving substrate |
| 摘要 |
A substrate for connecting one element having a first coefficient of thermal expansion to another element having a differing coefficient of thermal expansion that will alleviate interconnection problems due to thermal mismatch. |
| 申请公布号 |
US5874776(A) |
申请公布日期 |
1999.02.23 |
| 申请号 |
US19970840481 |
申请日期 |
1997.04.21 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
KRESGE, JOHN S.;WILCOX, JAMES R. |
| 分类号 |
H01L23/373;H01L23/498;H05K1/02;H05K1/05;H05K3/34;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/373 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
