发明名称 Target for a sputter cathode
摘要 The plate shaped target includes a frame (3, 4, 5, 7) which at least partially surrounds the target material (23) and holds the target on the cathode back plate. The frame incorporates hollow sections (3a, 4a,..7a') which are located laterally, are symmetrical about the middle plane (S) of the target, and serve as cooling channels. To produce the target, the frame made preferably of copper is placed onto a horizontal plane plate (preferably of stainless steel), is fixed to this plate, and is then filled with a molten target material. After solidification and cooling the target is fixed to the cathode back plate.
申请公布号 DE19735469(A1) 申请公布日期 1999.02.18
申请号 DE19971035469 申请日期 1997.08.16
申请人 LEYBOLD MATERIALS GMBH, 63450 HANAU, DE 发明人 KLEIN, EDGAR, 63549 RONNEBURG, DE
分类号 C23C14/34;(IPC1-7):C23C14/34;H01J37/34 主分类号 C23C14/34
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