首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
LEAD FRAME AND SEMICONDUCTOR PACKAGE
摘要
申请公布号
KR0136823(Y1)
申请公布日期
1999.02.18
申请号
KR19960004446U
申请日期
1996.03.11
申请人
HYUNDAI MICRO-ELECTRONICS CO.,LTD.
发明人
KWON, SUN-HOO
分类号
H01L23/495;(IPC1-7):H01L23/495
主分类号
H01L23/495
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Method of constructing a low torque shaft seal
Aligner, wafer transferring device, and semiconductor production device
Method for forming an image in stone
Extracting multiple identifiers from audio and video content
Stage apparatus
Advertisement monitoring system
Recording medium having a substrate containing microscopic pattern of parallel groove and land sections and recording/reproducing equipment therefor
Continuously variable transmission
Hybrid printer and scan image copying method
Aqueous mixtures curable physically, thermally or thermally and with actinic radiation
Organic-inorganic composite particle and process for preparation thereof
Spectral separation filters for 3D stereoscopic D-cinema presentation
Liquid detecting device, liquid container and method of manufacturing liquid detecting device
Long-chain inulin
Transaction product with gelatinous substance
Manufacturing method of semiconductor device
Thermophilic and thermoacidophilic sugar transporter genes and enzymes from alicyclobacillus acidocaldarius and related organisms, methods
Transparent conductive film, sintered body target for transparent conductive film fabrication, and transparent conductive base material and display device using the same
Asset monitoring system and portable security system therefor
Automatically controlling in-process software distributions through time prediction of a disturbance
