| 摘要 |
PROBLEM TO BE SOLVED: To realize a space efficiency and high cooling performance, by providing current feeding wiring materials having a heat pipe structure metal-bonded to components to be cooled. SOLUTION: Wiring materials 15 are metal-bonded e.g. soldered to a semiconductor element 10 at the lower ends, i.e., the heat absorbing side of a heat pipe. The element 10 to be cooled is mounted to a heat sink 14 through an insulation board 12. The water material having a heat pipe structure has an electrically extending extension line 16 to quickly carry the heat upwards from the element 10, thereby releasing heat via the surface of the wiring material 15 or extension line 16 to the outside air. Thus, it is possible to realize a high cooling performance and cooling structure superior in space efficiency. |
