发明名称 RELAY BUILT-IN CONTROLLER
摘要 PROBLEM TO BE SOLVED: To attain compactification and cost reduction, and enhance heat resistance and reliability in a relay built-in controller storing a relay. SOLUTION: Since heat radiation of a mounting base is accelerated and conductor resistance becomes low by using a lead frame 5 made of a copper alloy as the mounting base, heating of the base is suppessed to a small value. Heat damage to a relay 3 on the lead frame 5 and a HIC(hybrid integrated circuit) 4 or the like, and deterioration of a soldered portion are prevented thereby to prevent generation of operation trouble for them. A large radiator is not required, the number of part items is reduced since a connector terminal 5b is integrally provided in the lead frame 5, and An ECU(electric control unit) 1 is compactified to facilitate mounting in an engine room.
申请公布号 JPH1140035(A) 申请公布日期 1999.02.12
申请号 JP19970197620 申请日期 1997.07.23
申请人 OMRON CORP 发明人 ISHII HIROTAKA
分类号 B60R16/02;H01H50/04;H01H50/12;H01L23/48;H05K1/18;H05K3/20;(IPC1-7):H01H50/04 主分类号 B60R16/02
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