| 摘要 |
PROBLEM TO BE SOLVED: To provide a bump bonding method which can prevent the shape inferiority of the bump. SOLUTION: A gold ball 16 is made at the tip of a gold wire 1 passed into a capillary 3, and the capillary 3 is lowered, and also the vertical displacement of the capillary 3 is detected with a displacement sensor. Based on the displacement of the capillary 3 detected with a displacement sensor when the gold ball 16 abuts on an IC 11, the position of the electrode formation place of the IC 11 is detected, and the gold ball 16 is pressed against the electrode formation place to form a bump pedestal 17. Then, the capillary 3 is lifted and horizontally shifted by a certain quantity, and the level of stop position of the capillary 3 is set on the basis of the the height H1 of the bump pedestal 17 detected with a displacement detection sensor, and the capillary 3 is lowered again to the level S of the stop position so as to join the gold wire 1 to the bump pedestal 17, and then the gold wire 1 is pulled up, and the junction between the bump pedestal 17 and the gold wire 1 is split. |
