发明名称 TESTING METHOD FOR BALL GRID ARRAY TYPE INTEGRATED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To confirm the connection of all terminals to a printed board when multiple terminals are connected by providing current input/output terminals on the printed board, feeding a current, providing voltage measuring terminals, and measuring the voltage between the terminals. SOLUTION: The reference resistance valueΣRre between electrodes 8a, 8b, when the electrode 8a of the electrode group 8 of a printed board 3 connected with power terminals is electrically separated from the other electrode group, is measured in advance with a reference integrated circuit having the same circuit structure as that of a ball grid array type integrated circuit 1 subject to test and normally connected with the terminals to the printed board 3. The electrode 8a of the circuit 1 subject to test is separated, the resistance valueΣR between the electrodes 8a, 8b is measured,ΣRre andΣR are compared, and the connection state of the power terminals to the electrode group 8 is tested. A current source is connected between an input terminal 4 and an output terminal 6, a current is fed, a voltmeter is connected between the terminals 5, 7, and the voltage between the terminals 5, 7 is measured. The resistance value between the terminals 5, 7 can be thus measured.
申请公布号 JPH1138079(A) 申请公布日期 1999.02.12
申请号 JP19970192520 申请日期 1997.07.17
申请人 NEC CORP 发明人 MORITA TAKASHI
分类号 G01R31/26;H01L23/12;(IPC1-7):G01R31/26 主分类号 G01R31/26
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