Vorrichtung zum chemisch-mechanischen Polieren mit verbesserter Verteilung der Polierzusammensetzung

摘要

The disclosure relates to a chemical mechanical polishing apparatus which polishes substrates (12) on a rotating polishing pad (14) in the presence of a chemically active and/or physically abrasive slurry. At least one groove (26) is provided in the surface of the polishing pad to allow slurry to reach the surface of the substrate, which is engaged with the polishing pad. The groove extends at least partially in a radial direction. Additionally, a paid conditioning apparatus (100) may be placed onto the rotating polishing pad as substrates are being polished to continuously condition the polishing pad.