发明名称 |
Verfahren zum Herstellen eines Weichlotes, das ihre Form behaltende Zusatzpartikel enthält |
摘要 |
Of two sheet-like solder stocks, one sheet-like solder stock is fed at a constant speed, and additive particles having a constant particle diameter are spread on an upper surface of the one solder material sheet in a quantitative fixed quantity. The other sheet-like solder stock is stacked on the upper surface of the one sheet-like solder stock, and the two stacked solder stocks are rolled and integrally laminated by rollers. The laminated solder sheet is cut into a plurality of narrow solder strips. Each of the solder strips is wound on a reel, and supplied as a die bonding material capable of being used for the die bonding. Thus, if this solder is used for a semiconductor chip die bonding, the unevenness in thickness of the solder layer directly under the die-bonded semiconductor chip becomes small, and it is possible to minimize the error in the semiconductor chip recognition in the case of the wire bonding. <IMAGE> |
申请公布号 |
DE69410645(T2) |
申请公布日期 |
1999.02.11 |
申请号 |
DE1994610645T |
申请日期 |
1994.01.31 |
申请人 |
NEC CORP., TOKIO/TOKYO, JP |
发明人 |
HASHIMOTO, MITSURU, MINATO-KU, TOKYO, JP |
分类号 |
B23K35/40;B23K35/02;B23K35/14;H01L21/52;(IPC1-7):B23K35/14 |
主分类号 |
B23K35/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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