| 摘要 |
PROBLEM TO BE SOLVED: To enhance the heat radiating effect of a semiconductor device using microwaves and millimeter waves, without decreasing high frequency characteristics and the degree of freedom in design. SOLUTION: A semiconductor IC chip 1 is a flip-chip mounted on a wiring board 2, consisting of a dielectric having high thermal conductivity. Electrodes 5 and 6 are connected through a metal bump 4. A heat-dissipating diamond continuum 3, which comes into contact simultaneously with the upper surface (non-active surface) of the semiconductor IC chip 1 and the upper surface of the wiring board 2, is formed on the upper surface of the semiconductor IC chip 1 and the wiring board 2. Since the coefficient of thermal conductivity of diamond is very high at 1000 W/mK or higher, the heat generated when the semiconductor IC chip 1 is in operation is transmitted very efficiently from a heat, generating body 3 to the wiring board 2, through the diamond continuum 3 having a high thermal conductivity. |
