| 摘要 |
A lead frame apparatus that includes: an arrangement for dissipating heat generated at the lead frame, wherein the heat dissipating arrangement is uninterruptedly connected to the lead frame. Also contemplated herein are a lead frame heat dissipating apparatus having at least one element for dissipating heat generated at a lead frame and having an arrangement for directly and uninterruptedly connecting with a lead frame, as well as lead frame apparatus comprising an arrangement for directly and uninterruptedly accommodating at least one external element for dissipating heat generated at the lead frame. A method of making a lead frame apparatus involves the provision of a lead frame, the provision of an arrangement for dissipating heat generated at the lead frame, and the uninterrupted connection of the heat dissipating arrangement to the lead frame. A lead frame apparatus is also contemplated in which an arrangement for mechanically connecting a lead frame with a heat dissipating arrangement consists essentially of constituent portions of the lead frame and the heat dissipating apparatus. |
