| 摘要 |
PROBLEM TO BE SOLVED: To supply a special fluid phase chemical to a surface of a board by controllably discharging the capsuled material freely between a chemical and a mechanical polishing processes through the operation of process parameter such as an applying force. SOLUTION: Plural types of capsuled chemical are assembled in a polishing medium such as a polishing pad 63. As plural micro capsuled chemical, a reactive agent micro capsule A, a surface active micro capsule B, a buffer micro capsule C is used. These micro capsules A, B, C are broken at the time of use of them in a polishing process, and an appropriate quantity of a desirable chemical is directly supplied to a surface of a board to be polished or a wafer. Discharge of the content of the micro capsules A, B, C is controlled by the operation of a polishing parameter. The polishing parameter includes an appropriate value of downward force, friction coefficient, platen rotating speed, and wafer and carrier rotating speed for a specified chemical and mechanical polishing process. |
