METHOD AND BOARD FOR INSPECTING FLIP-CHIP IC

摘要

PROBLEM TO BE SOLVED: To ensure electrical connection of a flip-chip IC and a board by forming solder bump connection pad parts on a board in same pattern as the solder bumps of a semiconductor device while projecting above the surface of a thin film on the board. SOLUTION: Solder bump connection pad parts 7 of a conductive metal material are formed on the ceramic multilayer wiring board of an inspection board 3 in same pattern as the solder bumps 2 formed on a semiconductor TC 1 while projecting about 30μm above an insulating organic thin film 6. The semiconductor IC 1 is positioned on the inspection board 3 and mounted thereon in the atmosphere of inert gas, or the like, by IR reflow, or the like. The solder bump 2 on the semiconductor IC 1 is wetted surely to the connection pad part 7 to form an intermetallic compound thus providing a stabilized electric connection between the semiconductor IC 1 and the inspection board 3. Subsequently, an inspection probe 5 touches a probe contact inspection pad 4b to inspect the electrical characteristics of the semiconductor IC.