| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayered printed wiring board in which a conductive circuit with excellent adhesion is formed on a high heat-resistant insulating resin without mixing filler. SOLUTION: A titan metallic film 15 is formed on a photosensitive high heat resistant resin 13 formed on a base substrate by spattering, and then the titan metallic film 15 is removed by dry sandblast processing, so that the photosensitive high heat resistant resin 13 can be partially exposed. Then, the chemical etching of the exposed photosensitive high heat resistant resin 13 surface is carried out by using the residual titan metallic film 15 as a mask, and copper plating is operated so that an outermost layer conductive circuit 23 can be formed. |
