ELECTRONIC DEVICE SEALING FILM

摘要

PROBLEM TO BE SOLVED: To manufacture an electronic device sealing film of good workability demonstrated at the time of sealing an electronic device and also of high fire retardance to be used for sealing securely the electronic device in a good manner. SOLUTION: A heat curing and/or a photo-setting bonding agent layer constituted of a copolymer composed of ethylene, vinyl acetate and maleic acid and/or maleic anhydride as a main component doped with a phosphorus component as a fire retardant is formed at least on one face of a base film of light transmission properties on an electronic device sealing film. A bonding agent is formed of a copolymer of 100 pts.wt. doped with an organic peroxide of 0.1-1.0 pts.wt. Or the bonding agent is formed of a copolymer of 100 pts.wt. doped with a photosensitizer of 0.1-10 pts.wt.