发明名称 |
Epoxy resin composition with cycloaliphatic epoxy-functional siloxane |
摘要 |
A composition useful as a die-attach adhesive, polymer bump or encapsulant comprises from about 5-100% by weight of a base resin and from zero to 95% by weight of a particulate filler such as silver, wherein the base resin contains (a) from 10-95 parts by weight of a cycloaliphatic epoxy-functional siloxane, (b) from about 5-90 parts by weight of a non-silicon-containing polyepoxy resin, ©& from about 0.1-3 parts by weight of an iodonium salt, (d) from zero to about 3 parts by weight of a copper compound and, optionally, a silane adhesion promotor and/or an elastomeric toughener. |
申请公布号 |
US5863970(A) |
申请公布日期 |
1999.01.26 |
申请号 |
US19970794819 |
申请日期 |
1997.02.04 |
申请人 |
POLYSET COMPANY, INC.;MOTOROLA, INC. |
发明人 |
GHOSHAL, RAMKRISHNA;MUKERJI, PROSANTO |
分类号 |
C08G59/20;C08G59/22;C08G59/30;C08G59/32;C08G59/38;C08G59/68;C08K3/08;C08K5/00;C08K5/09;C08K5/5435;C08L63/00;C09J163/00;C09J201/00;H01L21/52;H01L21/58;H01L23/29;H01L23/31;H01L23/485;(IPC1-7):C08K3/08 |
主分类号 |
C08G59/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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