| 摘要 |
PROBLEM TO BE SOLVED: To enhance the reliability of an LSI base chip component at the time when the LSI bare chip component is mounted on a printed board by face down mounting by a method wherein the heating at the time of the formation of recesses in substrate electrodes and the heating for curing a bonding agent are performed separately from each other. SOLUTION: A Large Scale Integrated Circuit(LSI) bare chip component 1 formed with bump electrodes 4 and a printed board 2 are prepared. While the positions of the electrodes 4 and substrate electrodes 6 are accurately aligned with each other, a load is applied to the bare chip component 1 to press the chip component 1 to the board 2. A recess is formed in each substrate electrode 6. A bonding agent 7 is applied on a prescribed position on the board 2 and the LSI bare chip component 1 is pressed to the board 2. Here the heating at the time of the formation of the recesses and the heating for curing the bonding agent 7 are conducted separately from each other. Accordingly, both of the heating temperature for enabling the recesses to form in the electrodes 6 and the curing temperature of the bonding agent 7 can be properly maintained. Thereby, the reliability of a semiconductor device can be enhanced. |
