| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board which can be connected with a semiconduc tor element with a high connecting strength and a high reliability, when the semiconductor element is mounted on the circuit board. SOLUTION: Previously made in an electrode 5 on a circuit board 6 are recesses 4 which coincide in shape with bump electrodes 3 provided on a semiconductor element 1. The element 1 is once positioned with respect to the board 6 and then mounted thereon. At this time, the bump electrodes 3 on the element 1 are fitted into the recesses 4 made in the electrode 5 on the board 6. As a result, a high connecting strength to a horizontal stress can be obtained and a connection between the board and element can be obtained with an excellent reliability. |
