| 摘要 |
<p>Aqueous slurries are provided, which are useful for the chemical-mechanical polishing of substrates comprising titanium, comprising: water, submicron abrasive particles, an oxidizing agent, and a mono-, di-, or tri-substituted phenol wherein at least one of the substituted functional groups is polar. Optionally the compositions may also comprise a coumpound to suppress the rate of removal of silica. The slurries are useful on substrates which also comprise tungsten, aluminum or copper.</p> |
